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dc.contributor.advisorTummala, Rao R.
dc.contributor.authorZhang, Rui
dc.date.accessioned2021-01-11T17:10:50Z
dc.date.available2021-01-11T17:10:50Z
dc.date.created2020-12
dc.date.issued2020-11-19
dc.date.submittedDecember 2020
dc.identifier.urihttp://hdl.handle.net/1853/64135
dc.description.abstractThe development and application of artificial intelligence and augmented reality as well as billions of new devices connected to the network have resulted in unprecedented demands on high computing power and high speed communications. The focus has shifted from Moore’s law on the transistor density of semiconductor chips to post-Moore’s-law on the interconnect density of packages to continue improving the computing power and data rates. As the demand for data rates increases, electronic interconnects are limited to short-distance chip-to-chip communications by signal integrity issues at high frequency, which sheds a light on bringing optical interconnects onto the package for on-package long-distance communications. To address these challenges, this thesis focuses on integrating high-density electronic interconnects and low loss optical interconnects as well as fiber integration on glass interposers for high speed communications.
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.publisherGeorgia Institute of Technology
dc.subjectOptoelectronics interconnects
dc.subjectGlass interposers
dc.subjectMicrovias
dc.subjectSingle mode waveguides
dc.subjectFiber integration
dc.titleIntegration of optoelectronics interconnects on glass interposers for high speed communications
dc.typeDissertation
dc.description.degreePh.D.
dc.contributor.departmentElectrical and Computer Engineering
thesis.degree.levelDoctoral
dc.contributor.committeeMemberChang, Gee-Kung
dc.contributor.committeeMemberBakir, Muhannad S.
dc.contributor.committeeMemberVogel, Eric M.
dc.contributor.committeeMemberKathaperumal, Mohanalingam
dc.date.updated2021-01-11T17:10:50Z


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