Design and Demonstration of High-Performance Ultra-Thin Antenna-integrated 3D Glass-Based mm-wave Packages

Abstract

The fast-growing 5G wireless communications are emerging to transform a range of consumer and industrial sectors. Package integration of mm-wave components with antenna-in-package is one of the key enablers for high-speed wireless applications. This dissertation presents the modeling, design, and demonstration of high-performance ultra-thin antenna-integrated 3D glass-based mm-wave packages. The package-level integration for mm-wave elements and components into glass substrates offer higher component density, lower component-to-component signal losses, smaller footprint, thickness reduction, and equal to or lower cost compared to conventional organic- or ceramic-based substrates.