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    MODELING, DESIGN, FABRICATION AND DEMONSTRATION OF ULTRA-THIN, HIGH- PERFORMANCE GLASS PANEL EMBEDDED (GPE) PACKAGES FOR MM-WAVE APPLICATIONS

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    SHI-DISSERTATION-2020.pdf (6.751Mb)
    Date
    2020-12-08
    Author
    Shi, Tailong
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    Abstract
    The objective of the proposed research is to model, design, fabricate and demonstrate ultra-thin, highperformance ultra-thin glass panel embedded package (GPE) for mm-Wave applications. Ultra-thin lowwarpage and low die-shift GPE packages were first time demonstrated with thickness less than 150 μm applying advanced low-cost large panel based double side carrier process. Low-loss interconnects were modeled and designed with interconnection loss below 0.2 dB at 77 GHz enabled by ultra-low loss RDL dielectric, and optimized high precision processes for via drilling and photolithography with minimal variations in line and via geometries on glass substrates. A die-package codesign was proposed for highfrequency characterization of ultra-thin GPE package for mm-Wave applications. GPE packages with low system insertion loss (-0.6 dB @ 77 GHz) & low noise figure (2.9 dB @ 77 GHz) were demonstrated, enabled by chip-package co-design and GPE architecture.
    URI
    http://hdl.handle.net/1853/64217
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    • Georgia Tech Theses and Dissertations [23877]
    • School of Electrical and Computer Engineering Theses and Dissertations [3381]

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