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dc.contributor.advisorTummala, Rao R.
dc.contributor.authorShi, Tailong
dc.date.accessioned2021-01-11T17:14:43Z
dc.date.available2021-01-11T17:14:43Z
dc.date.created2020-12
dc.date.issued2020-12-08
dc.date.submittedDecember 2020
dc.identifier.urihttp://hdl.handle.net/1853/64217
dc.description.abstractThe objective of the proposed research is to model, design, fabricate and demonstrate ultra-thin, highperformance ultra-thin glass panel embedded package (GPE) for mm-Wave applications. Ultra-thin lowwarpage and low die-shift GPE packages were first time demonstrated with thickness less than 150 μm applying advanced low-cost large panel based double side carrier process. Low-loss interconnects were modeled and designed with interconnection loss below 0.2 dB at 77 GHz enabled by ultra-low loss RDL dielectric, and optimized high precision processes for via drilling and photolithography with minimal variations in line and via geometries on glass substrates. A die-package codesign was proposed for highfrequency characterization of ultra-thin GPE package for mm-Wave applications. GPE packages with low system insertion loss (-0.6 dB @ 77 GHz) & low noise figure (2.9 dB @ 77 GHz) were demonstrated, enabled by chip-package co-design and GPE architecture.
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.publisherGeorgia Institute of Technology
dc.subjectultra-thin
dc.subjectGlass Panel Embedding (GPE)
dc.titleMODELING, DESIGN, FABRICATION AND DEMONSTRATION OF ULTRA-THIN, HIGH- PERFORMANCE GLASS PANEL EMBEDDED (GPE) PACKAGES FOR MM-WAVE APPLICATIONS
dc.typeDissertation
dc.description.degreePh.D.
dc.contributor.departmentElectrical and Computer Engineering
thesis.degree.levelDoctoral
dc.contributor.committeeMemberSwaminathan, Madhavan
dc.contributor.committeeMemberPeterson, Andrew F.
dc.contributor.committeeMemberKathaperumal, Mohanalingam
dc.contributor.committeeMemberVogel, Eric
dc.date.updated2021-01-11T17:14:43Z


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