Additive manufacturing solutions for application-specific millimeter-wave wireless system design and packaging
Tehrani, Bijan Knight
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This thesis outlines the convergence of additive manurfacturing (AM) technology with the development of system-in-package (SiP) integration schemes for mm-Wave wireless systems. First-of-their-kind demonstrations of fundamental system and package components, such as high gain antennas, interconnects, and "smart" chip encapsulants, are presented utilizing fully-additive printing methods. The technologies outlined in these efforts highlight the potential for AM to further increase the design flexibility of mm-Wave systems at the module and device level, offering a new precedent of rapid, application-specific reconfigurability for the next generation of wireless technology.