• Congestion and Power Integrity Aware Placement and Routing for 3D Packaging 

      Minz, Jacob Rajkumar; Choi, Jinwoo; Swaminathan, Madhavan; Lim, Sung Kyu (Georgia Institute of Technology, 2004-04-23)
      One of the major concerns for a 3-D package is to deal with power supply noise. Decoupling Capacitances (decap) allocation is a powerful technique to suppress power supply noise. In this work we integrate noise analysis ...
    • Congestion-Driven Global Placement for Three Dimensional VLSI Circuits 

      Nanda, Vidit; Balakrishnan, Karthik; Ekpanyapong, Mongkol; Lim, Sung Kyu (Georgia Institute of Technology, 2003)
      The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wiring length. However, the problem of thermal dissipation is magnified due to the nature of these layered technologies. ...
    • Impact of Multi-level Clustering on Performance Driven Global Placement 

      Balakrishnan, Karthik; Nanda, Vidit; Ekpanyapong, Mongkol; Lim, Sung Kyu (Georgia Institute of Technology, 2003)
      Delay and wirelength minimization continue to be important objectives in the design of high-performance computing systems. For large-scale circuits, the clustering process becomes essential for reducing the problem size. ...
    • Thermal-aware 3D Microarchitectural Floorplanning 

      Ekpanyapong, Mongkol; Healy, Michael; Ballapuram, Chinnakrishnan S.; Lim, Sung Kyu; Lee, Hsien-Hsin Sean; Loh, Gabriel H. (Georgia Institute of Technology, 2004)
      Next generation deep submicron processor design will need to take into consideration many performance limiting factors. Flip flops are inserted in order to prevent global wire delay from becoming nonlinear, enabling deeper ...
    • Wire Congestion And Thermal Aware Global Placement For 3D VLSI Circuits 

      Balakrishnan, Karthik; Nanda, Vidit; Easwar, Siddharth Sangam; Lim, Sung Kyu (Georgia Institute of Technology, 2004-05-26)
      The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wiring length. However, wire congestion and thermal issues are exacerbated due to the compact nature of these layered ...