• Wire Congestion And Thermal Aware Global Placement For 3D VLSI Circuits 

      Balakrishnan, Karthik; Nanda, Vidit; Easwar, Siddharth Sangam; Lim, Sung Kyu (Georgia Institute of Technology, 2004-05-26)
      The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wiring length. However, wire congestion and thermal issues are exacerbated due to the compact nature of these layered ...