• System Impact of 3D Processor-Memory Interconnect: A Limit Study 

      Rasquinha, Mitchelle; Hassan, Syed Minhaj; Song, William; Chae, Kwanyeob; Cho, Minki; Mukhopadhyay, Saibal; Yalamanchili, Sudhakar (Georgia Institute of Technology, 2011)
      3D integration with through-silicon-vias (TSVs) can provide enormous bandwidth between processor die and memory die. The central goal of our work is to explore the limits of performance improvement that can be achieved ...