• Thermal-aware 3D Microarchitectural Floorplanning 

      Ekpanyapong, Mongkol; Healy, Michael; Ballapuram, Chinnakrishnan S.; Lim, Sung Kyu; Lee, Hsien-Hsin Sean; Loh, Gabriel H. (Georgia Institute of Technology, 2004)
      Next generation deep submicron processor design will need to take into consideration many performance limiting factors. Flip flops are inserted in order to prevent global wire delay from becoming nonlinear, enabling deeper ...