• Channel and Pin Assignment for Three Dimensional Packaging Routing 

      Minz, Jacob Rajkumar; Lim, Sung Kyu (Georgia Institute of Technology, 2004-05-24)
      Three dimensional packaging is becoming a popular concept because of the numerous advantages it has to offer over the existing conventional technologies. System on Packages (SOP) is an example of three dimensional packaging. ...
    • Congestion and Power Integrity Aware Placement and Routing for 3D Packaging 

      Minz, Jacob Rajkumar; Choi, Jinwoo; Swaminathan, Madhavan; Lim, Sung Kyu (Georgia Institute of Technology, 2004-04-23)
      One of the major concerns for a 3-D package is to deal with power supply noise. Decoupling Capacitances (decap) allocation is a powerful technique to suppress power supply noise. In this work we integrate noise analysis ...