• Global Routing Paradigm for System-on-Package 

      Minz, Jacob Rajkumar; Pathak, Mohit; Lim, Sung Kyu (Georgia Institute of Technology, 2003)
      The true potential of three dimensional System-On-Package (SOP) technology lies in its capability to integrate both active and passive components into a single high speed/density multi-layer packaging substrate. We propose ...
    • Multi-layer Floorplanning for Reliable System-on-Package 

      Shiu, Pun Hang; Lim, Sung Kyu (Georgia Institute of Technology, 2003)
      Physical design automation for the new emerging mixed-signal System-on-Package (SOP) technology requires a new kind of floorplanner--it must place both active components such as digital IC, analog ICs, memory modules, MEMS, ...