• Channel and Pin Assignment for Three Dimensional Packaging Routing 

      Minz, Jacob Rajkumar; Lim, Sung Kyu (Georgia Institute of Technology, 2004-05-24)
      Three dimensional packaging is becoming a popular concept because of the numerous advantages it has to offer over the existing conventional technologies. System on Packages (SOP) is an example of three dimensional packaging. ...
    • Generating Perfect Reversals of Simple Linear-Codes 

      Perumalla, Kalyan S. (Georgia Institute of Technology, 2003)
      Bi-directional execution - executing forward as well as in reverse - is useful in many contexts. However, traditional techniques for bi-directional execution are not scalable, as they require infinite storage in the ...
    • Global Routing for Three Dimensional Packaging 

      Minz, Jacob Rajkumar; Lim, Sung Kyu (Georgia Institute of Technology, 2003)
      Three dimensional packaging is becoming a popular concept because of the numerous advantages it has to offer over the existing conventional technologies. System on Packages (SOP) is an example of three dimensional packaging. ...
    • Layer Assignment for System on Packages 

      Minz, Jacob Rajkumar; Lim, Sung Kyu (Georgia Institute of Technology, 2003)
      The routing environment for the new emerging mixed-signal System-on-Package (SOP) technology is more advanced than that of the conventional PCB or MCM technology - pins are located at all layers of SOP packaging substrate ...
    • Minimum Information Disclosure with Efficiently Verifiable Credentials 

      Bauer, David; Blough, Douglas M.; Cash, David (Georgia Institute of Technology, 2007)
      Public-key based certificates provide a standard way to prove one's identity, as certified by some certificate authority (CA). However, standard certificates provide a binary identification: either the whole identity of ...
    • Multi-layer Floorplanning for Reliable System-on-Package 

      Shiu, Pun Hang; Lim, Sung Kyu (Georgia Institute of Technology, 2003)
      Physical design automation for the new emerging mixed-signal System-on-Package (SOP) technology requires a new kind of floorplanner--it must place both active components such as digital IC, analog ICs, memory modules, MEMS, ...
    • Spatial Alarm Processing and Algorithms 

      Doo, Myungcheol; Liu, Ling (Georgia Institute of Technology, 2011)
      One of the most challenging problems in scaling spatial alarm processing is to compute alarm free regions (AFR) such that mobile objects traveling within an AFR can safely hibernate the alarm evaluation process until ...
    • Thermal-aware 3D Microarchitectural Floorplanning 

      Ekpanyapong, Mongkol; Healy, Michael; Ballapuram, Chinnakrishnan S.; Lim, Sung Kyu; Lee, Hsien-Hsin Sean; Loh, Gabriel H. (Georgia Institute of Technology, 2004)
      Next generation deep submicron processor design will need to take into consideration many performance limiting factors. Flip flops are inserted in order to prevent global wire delay from becoming nonlinear, enabling deeper ...
    • Thermal-driven Circuit Partitioning and Floorplanning with Power Optimization 

      Lee, Kyoung-Keun; Paradise, Edward J.; Lim, Sung Kyu (Georgia Institute of Technology, 2003)
      In this paper, we present methodology to distribute the temperature of gates evenly on a chip while simultaneously reducing the power consumption by using newly designed partitioning and floorplanning algorithms. This new ...