• Congestion-Driven Global Placement for Three Dimensional VLSI Circuits 

      Nanda, Vidit; Balakrishnan, Karthik; Ekpanyapong, Mongkol; Lim, Sung Kyu (Georgia Institute of Technology, 2003)
      The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wiring length. However, the problem of thermal dissipation is magnified due to the nature of these layered technologies. ...
    • Thermal-aware 3D Microarchitectural Floorplanning 

      Ekpanyapong, Mongkol; Healy, Michael; Ballapuram, Chinnakrishnan S.; Lim, Sung Kyu; Lee, Hsien-Hsin Sean; Loh, Gabriel H. (Georgia Institute of Technology, 2004)
      Next generation deep submicron processor design will need to take into consideration many performance limiting factors. Flip flops are inserted in order to prevent global wire delay from becoming nonlinear, enabling deeper ...
    • Wire Congestion And Thermal Aware Global Placement For 3D VLSI Circuits 

      Balakrishnan, Karthik; Nanda, Vidit; Easwar, Siddharth Sangam; Lim, Sung Kyu (Georgia Institute of Technology, 2004-05-26)
      The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wiring length. However, wire congestion and thermal issues are exacerbated due to the compact nature of these layered ...