Low cost next generation flip chip assembly process development

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Please use this identifier to cite or link to this item: http://hdl.handle.net/1853/9558

Title: Low cost next generation flip chip assembly process development
Author: Baldwin, Daniel F.
Description: Issued as final report
Type: Technical Report
URI: http://hdl.handle.net/1853/9558
Date: 1998
Contributor: Georgia Institute of Technology. School of Mechanical Engineering
Georgia Institute of Technology. Office of Sponsored Programs
Relation: School of Mechanical Engineering; Project no. E-25-A80
Publisher: Georgia Institute of Technology
Subject: Electronic circuits Design and testing
Microelectronic packaging

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