Show simple item record

dc.contributor.authorBaldwin, Daniel F.en_US
dc.date.accessioned2006-05-11T15:14:00Z
dc.date.available2006-05-11T15:14:00Z
dc.date.issued1998en_US
dc.identifier.urihttp://hdl.handle.net/1853/9558
dc.descriptionIssued as final reporten_US
dc.format.extent4468475 bytes
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.publisherGeorgia Institute of Technologyen_US
dc.relation.ispartofseriesSchool of Mechanical Engineering; Project no. E-25-A80en_US
dc.subjectElectronic circuits Design and testingen_US
dc.subjectMicroelectronic packagingen_US
dc.titleLow cost next generation flip chip assembly process developmenten_US
dc.typeTechnical Reporteng_US
dc.contributor.corporatenameGeorgia Institute of Technology. School of Mechanical Engineeringen_US
dc.contributor.corporatenameGeorgia Institute of Technology. Office of Sponsored Programs
dc.contributor.corporatenameGeorgia Institute of Technology. Office of Sponsored Programs


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record