Study on adhesion of underfill materials for flip chip packaging

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Please use this identifier to cite or link to this item: http://hdl.handle.net/1853/10112

Title: Study on adhesion of underfill materials for flip chip packaging
Author: Luo, Shijian
Type: Dissertation
URI: http://hdl.handle.net/1853/10112
Date: 2002-05
Publisher: Georgia Institute of Technology
Subject: Integrated circuits Reliability
Electronic packaging
Department: Textile and Fiber Engineering
Polymers
Advisor: C.P. Wong
Degree: Ph.D.

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