Multiwire microstrip interconnects for high-frequency integrated circuit packaging

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Please use this identifier to cite or link to this item: http://hdl.handle.net/1853/15454

Title: Multiwire microstrip interconnects for high-frequency integrated circuit packaging
Author: Cafaro, Nicholas Giovanni, Jr.
Type: Thesis
URI: http://hdl.handle.net/1853/15454
Date: 2000-05
Publisher: Georgia Institute of Technology
Subject: Wire bonding (Electronic packaging)
Microwave circuits
Department: Electrical and computer engineering
Electric engineering
Advisor: Joy Laskar
Degree: M.S.

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