Packaging and Characterization of MEMS Optical Microphones

Show simple item record Garcia, Caesar Theodore en_US 2008-02-07T18:12:15Z 2008-02-07T18:12:15Z 2007-11-15 en_US
dc.description.abstract Miniature microphones have numerous applications but often exhibit poor performance which can be attributed to the challenges associated with capacitive detection at small size scales. Optical detection methods are able to overcome some of these challenges although miniaturized integration of these optical systems has not yet been demonstrated. An optical interferometric detection scheme is presented and is implemented using micro-scale optoelectronic devices which are used primarily in fiber optic data transmission. Using basic diffraction theory, a model is developed and used to optimize the micro-optical system within a 1mm3 volume. Both omnidirectional and directional optical microphone designs are presented and a modular packaging architecture is assembled in order to test these devices. Results from the 2mm diameter omnidirectional optical microphone structure demonstrate a 26dBA noise floor. The biomimetic directional optical microphone, which has an equivalent port spacing of 1mm, demonstrates a noise floor of 34dBA. Additionally, these results demonstrate an array of two biomimetic directional optical microphones located on the same silicon chip and separated by less than 5mm. These results confirm the micro-optical detection method as an alternative to capacitive detection especially for miniaturized microphone applications and suggest that this method in its modular packaging architecture is competitive with industry leading measurement microphones. en_US
dc.publisher Georgia Institute of Technology en_US
dc.subject MEMS en_US
dc.subject Interferometry en_US
dc.subject Optical en_US
dc.subject Microphone en_US
dc.subject.lcsh Microphone
dc.subject.lcsh Microelectromechanical systems
dc.subject.lcsh Computer simulation
dc.title Packaging and Characterization of MEMS Optical Microphones en_US
dc.type Thesis en_US M.S. en_US
dc.contributor.department Mechanical Engineering en_US
dc.description.advisor Committee Chair: Levent Degertekin; Committee Member: Kenneth Cunefare; Committee Member: Peter Hesketh en_US

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