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dc.contributor.authorKohl, Paul A.
dc.contributor.authorSpencer, Todd
dc.contributor.authorOsborn, Tyler
dc.date.accessioned2008-09-29T12:29:32Z
dc.date.available2008-09-29T12:29:32Z
dc.date.issued2008-09-09
dc.identifier.urihttp://hdl.handle.net/1853/25011
dc.descriptionPaul A. Kohl, Todd Spencer and Tyler Osborn from the School of Chemical and Biomolecular Engineering presented a lecture at the Nano@Tech Meeting on September 9, 2008 at 12 noon in room 102 of the MiRC building.en
dc.descriptionRuntime: 61:09 minutes
dc.description.abstractThe "off-chip" bandwidth is a major bottleneck causing system delays and limited throughput, especially in areas such as processor-to-memory bandwidth and processor-to-network. The ITRS cites off-chip signal bandwidth exceeding 60 GHz within 10 years. Organic substrates (i.e. chip packages or interposers) with flip-chip solder connections are the core of the first and second level of interconnect. Off-chip bandwidth is limited to several GHz due to frequency dependent attenuation, signal reflections, and crosstalk within the polymer dielectric, via structures, and I/O signal path transitions within the chip substrate and mother board. In this work, we have introduced advances in off-chip interconnect using air-isolated, coaxial links on substrates and boards to demonstrate ultra high-speed chip-to-chip and chip-to-network communications. New approaches have been found to fabricating high frequency I/O, air-and isolated coaxial links on the substrate. The materials, processes and electrical characteristics will be presented.
dc.format.extent61:09 minutes
dc.language.isoen_USen
dc.publisherGeorgia Institute of Technologyen
dc.subjectNanotechnologyen
dc.subjectInterconnecten
dc.subjectMicroelectronicsen
dc.subjectOff-chip bandwidth
dc.titleHigh-Performance Chip-to-Chip Communications Using Advanced Materials and Structuresen
dc.title.alternativeIntegrated Circuits:The Problem with Wires (and Some Solutions)en
dc.typeLectureen
dc.typeVideo
dc.contributor.corporatenameGeorgia Institute of Technology. School of Chemical and Biomolecular Engineering


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