High-Performance Chip-to-Chip Communications Using Advanced Materials and Structures

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dc.contributor.author Kohl, Paul A.
dc.contributor.author Spencer, Todd
dc.contributor.author Osborn, Tyler
dc.date.accessioned 2008-09-29T12:29:32Z
dc.date.available 2008-09-29T12:29:32Z
dc.date.issued 2008-09-09
dc.identifier.uri http://hdl.handle.net/1853/25011
dc.description Paul A. Kohl, Todd Spencer and Tyler Osborn from the School of Chemical and Biomolecular Engineering presented a lecture at the Nano@Tech Meeting on September 9, 2008 at 12 noon in room 102 of the MiRC building. en
dc.description Runtime: 61:09 minutes
dc.description.abstract The "off-chip" bandwidth is a major bottleneck causing system delays and limited throughput, especially in areas such as processor-to-memory bandwidth and processor-to-network. The ITRS cites off-chip signal bandwidth exceeding 60 GHz within 10 years. Organic substrates (i.e. chip packages or interposers) with flip-chip solder connections are the core of the first and second level of interconnect. Off-chip bandwidth is limited to several GHz due to frequency dependent attenuation, signal reflections, and crosstalk within the polymer dielectric, via structures, and I/O signal path transitions within the chip substrate and mother board. In this work, we have introduced advances in off-chip interconnect using air-isolated, coaxial links on substrates and boards to demonstrate ultra high-speed chip-to-chip and chip-to-network communications. New approaches have been found to fabricating high frequency I/O, air-and isolated coaxial links on the substrate. The materials, processes and electrical characteristics will be presented.
dc.format.extent 61:09 minutes
dc.language.iso en_US en
dc.publisher Georgia Institute of Technology en
dc.subject Nanotechnology en
dc.subject Interconnect en
dc.subject Microelectronics en
dc.subject Off-chip bandwidth
dc.title High-Performance Chip-to-Chip Communications Using Advanced Materials and Structures en
dc.title.alternative Integrated Circuits:The Problem with Wires (and Some Solutions) en
dc.type Lecture en
dc.type Video
dc.contributor.corporatename Georgia Institute of Technology. School of Chemical and Biomolecular Engineering

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