Novel Nano-Scale Conductive Films With Enhanced Electrical Performance and Reliability for High Performance Fine Pitch Interconnect

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Please use this identifier to cite or link to this item: http://hdl.handle.net/1853/30603

Title: Novel Nano-Scale Conductive Films With Enhanced Electrical Performance and Reliability for High Performance Fine Pitch Interconnect
Author: Li, Yi ; Yim, Myung Jin ; Moon, Kyoung-Sik ; Wong, C. P.
Abstract: In this paper, a novel nano-scale conductive film which combines the advantages of both traditional anisotropic conductive adhesives/films (ACAs/ACFs) and nonconductive adhesives/films (NCAs/NCFs) is introduced for next generation high-performance ultra-fine pitch packaging applications. This novel interconnect film possesses the properties of electrical conduction along the z direction with relatively low bonding pressure (ACF-like) and the ultra-fine pitch (< 30 μm) capability (NCF-like). The nano-scale conductive film also allows a lower bonding pressure than NCF to achieve a much lower joint resistance (over two orders of magnitude lower than typical ACF joints) and higher current carrying capability. With low temperature sintering of nano-silver fillers, the joint resistance of the nano-scale conductive film was as low as 10―5 Ohm. The reliability of the nano-scale conductive film after high temperature and humidity test (85°C/85% RH) was also improved compared to the NCF joints. The insertion loss of nano-scale conductive film joints up to 10 GHz was almost the same as that of the standard ACF or NCF joints, suggesting that the nano-scale conductive film is suitable for reliable high-frequency adhesive joints in microelectronics packaging.
Description: © 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. DOI: 10.1109/TCAPT.2009.2012720
Type: Article
URI: http://hdl.handle.net/1853/30603
ISSN: 1521-3323
Citation: Yi Li, Myung Jin Yim, Kyoung Sik Moon, and C. P. Wong, "Novel Nano-Scale Conductive Films With Enhanced Electrical Performance and Reliability for High Performance Fine Pitch Interconnect," IEEE Transactions on Advanced Packaging, Vol. 32, No. 1, February 2009 123-129
Date: 2009-02
Contributor: Georgia Institute of Technology. School of Materials Science and Engineering
Publisher: Georgia Institute of Technology
Institute of Electrical and Electronics Engineers, Inc., New York
Subject: Bonding processes
Electrical conductivity
Integrated circuit interconnections
Integrated circuit packaging
Integrated circuit reliability
Nanotechnology
Sintering
Thin films

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