Global Routing for Three Dimensional Packaging

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Title: Global Routing for Three Dimensional Packaging
Author: Minz, Jacob Rajkumar ; Lim, Sung Kyu
Abstract: Three dimensional packaging is becoming a popular concept because of the numerous advantages it has to offer over the existing conventional technologies. System on Packages (SOP) is an example of three dimensional packaging. The contribution of this work is threefold: (i) formulation of the new 3-dimensional global routing problem, (ii) a new routing flow that considers the various design constraints unique to SOP, and (iii) a global router for the technology. Our related experimental results demonstrate the effectiveness of our algorithm.
Type: Technical Report
Date: 2003
Relation: CERCS;GIT-CERCS-03-24
Publisher: Georgia Institute of Technology
Subject: Algorithms
Design constraints
Global routing algorithm
System-on-Package (SOP)
Three dimensional global routing
Three dimensional packaging

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